IPW60R099P7 Entsha Eyoqobo Esesitokweni Ukulethwa Ngokushesha I-IC Chip Electronic Components BOM Service Ye-IPW60R099P7

Izimfanelo Zomkhiqizo

Amadokhumenti Nemidiya

Izigaba Zemvelo Nokuthekelisa

Izinsiza Ezengeziwe

Isekethe ehlanganisiwe iyisisetshenziswa esincane sikagesi noma ingxenye.Kusetshenziswa inqubo ethile, ama-transistors adingekayo, ama-resistors, ama-capacitor kanye nama-inductors kusekethe kanye ne-wiring interconnect ndawonye, ​​enziwe engxenyeni eyodwa noma eminingana ye-semiconductor wafer noma i-dielectric substrate, bese ivalwa egobolondweni, ukuze ibe yisakhiwo esincane imisebenzi yesifunda edingekayo;Zonke izingxenye zakhiwe zizonke ngesakhiwo, okwenza izingxenye ze-elekthronikhi zibheke ezintweni ezincane, ukusetshenziswa kwamandla okuphansi, ukuhlakanipha nokuthembeka okuphezulu isinyathelo esikhulu esiya phambili.Isekethe edidiyelwe yasungulwa ngeminyaka yawo-1970s nguJack Kilby [Germanium (Ge) based integrated circuit] kanye noRobert Neuth [silicon (Si) based integrated circuit].

Uma usayizi we-IC umkhulu, kuba nzima nakakhulu ukwakha uhlelo ukuze luvumelane nezidingo ezithile zokuxazulula lezi zinkinga.Ngakho-ke, ukubonakala kokubamba iqhaza komsebenzisi ekwakhiweni kwesekethe edidiyelwe yesicelo esithile (ASIC), ingakwazi ukubona ukwenziwa kahle komklamo wonke wesistimu, ukusebenza okuphezulu, ubumfihlo obuqinile.I-Asic ingenza ngokulandelana imisebenzi ethile yemisebenzi eminingana, eminingi, noma ngisho namakhulu ejwayelekile, imisebenzi yesekethe ehlanganisiwe yezinga elincane ehlanganiswe ku-chip, bese lonke uhlelo lungahlanganiswa ku-chip, ukuze kuzuzwe izidingo zohlelo.Kwenza ukuthuthukiswa kwesifunda sonke, inani lezingxenye lincishisiwe, izintambo zifinyezwe, ivolumu nesisindo sincishisiwe, sithuthukise ukuthembeka kwesistimu.