Ukuhlaziywa kokwehluleka kwe-IC chip

Ukuhlaziywa kokwehluleka kwe-IC chip,ICizifunda ezihlanganisiwe ze-chip azikwazi ukugwema ukwehluleka ohlelweni lokuthuthukiswa, ukukhiqizwa nokusetshenziswa.Ngokuthuthukiswa kwezidingo zabantu zekhwalithi nokuthembeka komkhiqizo, umsebenzi wokuhlaziya ukwehluleka uya ngokuya ubaluleka.Ngokuhlaziya ukwehluleka kwe-chip, i-IC chip yabaklami ingathola amaphutha ekwakhiweni, ukungqubuzana kwemingcele yezobuchwepheshe, ukuklama okungalungile nokusebenza, njll. Ukubaluleka kokuhlaziywa kokwehluleka kubonakala ngokuyinhloko kokuthi:

Ngokuningiliziwe, ukubaluleka okuyinhloko kweICUkuhlaziywa kokwehluleka kwe-chip kuboniswa kulezi zici ezilandelayo:

1. Ukuhlaziywa kokwehluleka kuyindlela ebalulekile kanye nendlela yokunquma indlela yokuhluleka kwama-IC chips.

2. Ukuhlaziywa kwamaphutha kunikeza ulwazi oludingekayo ukuze kuhlonzwe iphutha elisebenzayo.

3. Ukuhlaziywa kokwehluleka kunikeza onjiniyela bokuklama intuthuko eqhubekayo kanye nokuthuthukiswa komklamo we-chip ukuze kuhlangatshezwane nezidingo zokucaciswa kwedizayini.

4. Ukuhlaziywa kokwehluleka kungahlola ukusebenza kahle kwezindlela zokuhlola ezihlukene, kunikeze izithasiselo ezidingekayo zokuhlolwa kokukhiqiza, futhi kunikeze ulwazi oludingekayo ukuze kuthuthukiswe futhi kuqinisekiswe inqubo yokuhlola.

Izinyathelo eziyinhloko nokuqukethwe kokuhlaziywa kokwehluleka:

◆Ukuqaqa ukupakisha kwesekethe ehlanganisiwe: Ngenkathi ukhipha isifunda esihlanganisiwe, gcina ubuqotho bomsebenzi we-chip, gcina ukufa, ama-bondpad, ama-bondwires kanye nozimele womthofu, futhi ulungiselele ukuhlolwa kokuhlaziya ukuvinjelwa kwe-chip okulandelayo.

◆Isibuko sokuskena se-SEM/Ukuhlaziywa kokubunjwa kwe-EDX: ukuhlaziywa kwesakhiwo sezinto ezibonakalayo/ukubona iphutha, ukuhlaziya okujwayelekile kwendawo encane yokubunjwa kwesici, ukulinganisa okulungile kosayizi wokuqamba, njll.

◆ Ukuhlolwa kwe-Probe: Isignali kagesi ngaphakathi kwe-ICingatholakala ngokushesha futhi kalula ngokusebenzisa micro-probe.I-Laser: I-Micro-laser isetshenziselwa ukusika indawo ethile ephezulu ye-chip noma ucingo.

◆Ukutholwa kwe-EMMI: Isibonakhulu sokukhanya okuphansi kwe-EMMI ithuluzi lokuhlaziya iphutha elisebenza kahle kakhulu, elihlinzeka ngendlela yamaphutha ezwela kakhulu futhi engabhubhisi.Ingathola futhi yenze indawo ye-luminescence ebuthaka kakhulu (ebonakalayo futhi eseduze ne-infrared) futhi ibambe ukuvuza kwemisinga okubangelwa ukukhubazeka nokudidayo ezingxenyeni ezihlukahlukene.

◆Uhlelo lokusebenza lwe-OBIRCH (ukuhlolwa kokushintsha inani le-laser beam-induced impedance): I-OBIRCH ivamise ukusetshenziselwa ukuhlaziya okubambezeleke kakhulu kanye nokungena kancane ngaphakathi. ICama-chips, nokuhlaziywa kwendlela yokuvuza komugqa.Ngokusebenzisa indlela ye-OBIRCH, okungalungile kumasekhethi kungatholakala kahle, njengezimbobo emigqeni, imigodi ngaphansi kwezimbobo, nezindawo eziphakeme ezingakwazi ukumelana nezinga eliphansi ngaphansi kwezimbobo.Izengezo ezilandelayo.

◆ Ukutholwa kwendawo eshisayo yesikrini se-LCD: Sebenzisa isikrini se-LCD ukuze uthole ukuhlelwa kwamangqamuzana nokuhlelwa kabusha endaweni yokuvuza ye-IC, futhi ubonise isithombe esimise okwechashaza esihlukile kwezinye izindawo ngaphansi kwesibonakhulu ukuze uthole indawo yokuvuza (iphuzu lephutha elikhulu kune 10mA) ezophazamisa umklami ekuhlaziyeni kwangempela.Iphuzu elingaguquki/elingagxilile-iphuzu lokugaya i-chip: susa amaqhuqhuva egolide afakwe ku-Pad ye-chip yomshayeli we-LCD, ukuze i-Pad ingonakaliswe ngokuphelele, okulungele ukuhlaziya nokuphinda kuhlanganiswe.

◆ Ukuhlolwa kwe-X-Ray okungacekeleki phansi: Thola amaphutha ahlukahlukene ku ICukupakishwa kwe-chip, njengokuxebuka, ukuqhuma, i-voids, ubuqotho bezintambo, i-PCB ingase ibe neziphambeko ezithile enqubweni yokukhiqiza, njengokungaqondani kahle kahle noma ibhuloho, isifunda esivulekile, isifunda esifushane noma okungavamile Ukonakala ekuxhumekeni, ubuqotho bamabhola athengiswayo kumaphakheji.

◆SAM (SAT) ukutholwa kwamaphutha nge-ultrasonic kungakwazi ukubona ngokulimaza isakhiwo ngaphakathiICiphakethe le-chip, futhi ibone ngempumelelo umonakalo ohlukahlukene obangelwa umswakama namandla ashisayo, njenge-O wafer surface delamination, O amabhola e-solder, ama-wafers noma ama-fillers Kukhona izikhala ezintweni zokupakisha, ama-pores ngaphakathi kwempahla yokupakisha, izimbobo ezihlukahlukene ezifana ne-wafer bonding surfaces. , amabhola e-solder, izigcwalisi, njll.