Original In Stock Integrated Circuit XC3S200-4PQG208C XC6VSX315T-2FFG1156I XC9572XL-10VQ64C XC6SLX252CSG324C Ic Chip
Izimfanelo Zomkhiqizo
UHLOBO | DESCRIPTION | KHETHA |
Isigaba | Izifunda Ezihlanganisiwe (ICs)Kushumekiwe |
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Mfr | I-AMD |
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Uchungechunge | I-Virtex®-6 SXT |
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Iphakheji | Ithreyi |
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Isimo somkhiqizo | Iyasebenza |
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Inombolo yama-LAB/CLBs | 24600 |
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Inombolo Yezinto Ezinengqondo/Amaseli | 314880 |
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Isamba se-RAM Bits | 25952256 |
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Inombolo ye-I/O | 600 |
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I-Voltage - Ukunikezwa | 0.95V ~ 1.05V |
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Uhlobo Lokukhweza | INtaba Engaphezulu |
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Izinga Lokushisa Lokusebenza | -40°C ~ 100°C (TJ) |
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Iphakheji / Ikesi | 1156-BBGA, FCBGA |
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Iphakheji Yedivayisi Yomhlinzeki | 1156-FCBGA (35×35) |
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Inombolo Yomkhiqizo Eyisisekelo | I-XC6VSX315 |
Amadokhumenti Nemidiya
UHLOBO LOKUSEBENZA | LINK |
Datasheets | Idatha ye-Virtex-6 FPGAI-Virtex-6 FPGA Uhlolojikelele Lomndeni |
Amamojula Wokuqeqesha Umkhiqizo | Virtex-6 FPGA Uhlolojikelele |
Ulwazi Lwezemvelo | I-Xiliinx RoHS CertI-Xilinx REACH211 Cert |
I-PCN Design/Specification | I-Mult Dev Material Chg 16/Dec/2019 |
Izigaba Zemvelo Nokuthekelisa
ISIQINISEKISO | DESCRIPTION |
Isimo se-RoHS | I-ROHS3 Iyahambisana |
Izinga Lokuzwela Komswakama (MSL) | 4 (72 amahora) |
FIKA Isimo | FIKA Ungathintekile |
ECCN | 3A991D |
HTSUS | 8542.39.0001 |
Izifunda Ezihlanganisiwe
Isekethe edidiyelwe (IC) iyi-chip ye-semiconductor ethwala izinto eziningi ezincane njengama-capacitor, ama-diode, ama-transistors, nama-resistors.Lezi zingxenye ezincane zisetshenziselwa ukubala nokugcina idatha ngosizo lobuchwepheshe bedijithali noma be-analog.Ungacabanga nge-IC njenge-chip encane engasetshenziswa njengesifunda esiphelele, esithembekile.Amasekhethi ahlanganisiwe angaba ikhawunta, i-oscillator, i-amplifier, isango elinengqondo, isibali sikhathi, inkumbulo yekhompyutha, noma i-microprocessor.
I-IC ithathwa njengesakhiwo esiyisisekelo sazo zonke izinto zikagesi zanamuhla.Igama laso liphakamisa uhlelo lwezingxenye eziningi ezixhumene ezishumekwe kumpahla encane, eyenziwe nge-silicon-made semiconductor.
Umlando Weziyingi Ezihlanganisiwe
Ubuchwepheshe besekethe edidiyelwe baqale bethulwa ngo-1950 nguRobert Noyce noJack Kilby e-United States of America.I-US Air Force yayingumthengi wokuqala walokhu kusungulwa okusha.UJack naye uKilby uqhubekile nokuwina uMklomelo KaNobel kuPhysics ngo-2000 ngokusungula kwakhe ama-ICs amancane.
Eminyakeni engu-1.5 ngemva kokwethulwa komklamo kaKilby, uRobert Noyce wethula inguqulo yakhe yesekethe ehlanganisiwe.Imodeli yakhe ixazulule izinkinga ezimbalwa ezisebenzayo kudivayisi kaKilby.UNoyce uphinde wasebenzisa i-silicon ekwenzeni imodeli yakhe, kuyilapho uJack Kilby esebenzisa i-germanium.
URobert Noyce noJack Kilby bobabili bathole amalungelo obunikazi ase-US ngeqhaza labo kumasekethe ahlanganisiwe.Bazabalaza nezindaba zomthetho iminyaka eminingana.Ekugcineni, zombili izinkampani zika-Noyce kanye ne-Kilby zanquma ukweqa amalayisense eziqanjiwe futhi zikwethule emakethe enkulu yomhlaba wonke.
Izinhlobo Zesekhethi Ezihlanganisiwe
Kunezinhlobo ezimbili zamasekethe ahlanganisiwe.Lezi izi:
1. I-Analog ICs
I-Analog ICs inokukhiphayo okuguquguqukayo njalo, kuye ngesignali abayitholayo.Ngokombono, ama-IC anjalo angathola inani elingenamkhawulo lezifunda.Kulolu hlobo lwe-IC, izinga lokuphumayo lokunyakaza liwumsebenzi womugqa wezinga lokufakwayo lesiginali.
I-Linear ICs ingasebenza njengezikhulisi zerediyo-frequency (RF) kanye ne-audio-frequency (AF).I-amplifier yokusebenza (op-amp) iyidivayisi evame ukusetshenziswa lapha.Ngaphezu kwalokho, inzwa yokushisa ingenye isicelo esivamile.Ama-ICs olayini angavula futhi avale amadivayisi ahlukahlukene uma isignali isifinyelele inani elithile.Lobu buchwepheshe ungabuthola kumahhavini, kumahitha, nakuma-air conditioner.
2. Ama-ICs edijithali
Lezi zihlukile kuma-IC analogi.Azisebenzi phezu kwebanga elingaguquki lamazinga esignali.Kunalokho, asebenza kumazinga ambalwa asethwe ngaphambilini.Ama-ICs edijithali asebenza ngokuyisisekelo ngosizo lwamasango anengqondo.Amasango anengqondo asebenzisa idatha kanambambili.Amasignali kudatha kanambambili anamaleveli amabili kuphela aziwa ngokuthi aphansi (logic 0) kanye naphezulu (logic 1).
Ama-ICs edijithali asetshenziswa kuzinhlelo zokusebenza ezahlukahlukene njengamakhompyutha, amamodemu, njll.
Kungani Izifunda Ezihlanganisiwe Zidumile?
Yize yasungulwa cishe eminyakeni engama-30 edlule, amasekethe ahlanganisiwe asasetshenziswa ezinhlelweni eziningi.Ake sixoxe ngezinye zezinto ezinesibopho sokuduma kwazo :
1.Ukuqina
Eminyakeni embalwa edlule, imali engenayo yemboni ye-semiconductor yafinyelela ku-350 Billion USD emangalisayo.I-Intel yaba negalelo elikhulu lapha.Kwakukhona nabanye abadlali, futhi iningi lalaba bekungezamakethe yedijithali.Uma ubheka izinombolo, uzobona ukuthi amaphesenti angu-80 okuthengiswa okukhiqizwa imboni ye-semiconductor kwakuvela kule makethe.
Amasekethe adidiyelwe adlale indima enkulu kule mpumelelo.Uyabona, abacwaningi bemboni ye-semiconductor bahlaziye isekethe edidiyelwe, ukusetshenziswa kwayo, kanye nokucaciswa kwayo futhi bakukhuphula.
I-IC yokuqala eyake yasungulwa yayinama-transistors ambalwa nje - ama-5 ukuze acacise.Futhi manje sesiyibonile i-Intel's 18-core Xeon enama-transistors ayizigidi eziyizinkulungwane ezingama-5.5.Ngaphezu kwalokho, I-IBM's Storage Controller yayinama-transistors angu-7.1 billion anenqolobane engu-480 MB L4 ngo-2015.
Lokhu kukhula kudlale indima enkulu ekudumeni okukhona kwe-Integrated Circuits.
2. Izindleko
Kube nezinkulumo mpikiswano eziningana mayelana nezindleko ze-IC.Eminyakeni edlule, kube nokungaqondi kahle mayelana nenani langempela le-IC.Isizathu salokhu ukuthi ama-IC awasewona umqondo olula.Ubuchwepheshe buya phambili ngesivinini esimangalisayo, futhi abaklami bama-chip kufanele bahambisane nalesi sivinini lapho bebala izindleko ze-IC.
Eminyakeni embalwa edlule, ukubalwa kwezindleko ze-IC kwakusetshenziselwa ukuthembela ku-silicon die.Ngaleso sikhathi, ukulinganisa izindleko ze-chip kunganqunywa kalula ngosayizi wokufa.Nakuba i-silicon iseyingxenye eyinhloko ekubaleni kwabo, ochwepheshe badinga ukucabangela ezinye izingxenye lapho bebala izindleko ze-IC, futhi.
Kuze kube manje, ochwepheshe bathole isibalo esilula ukuze banqume izindleko zokugcina ze-IC:
Izindleko Zokugcina ze-IC = Izindleko Zephakheji + Izindleko Zokuhlola + Izindleko Zokufa + Izindleko Zokuthumela
Le zibalo ibheka zonke izakhi ezidingekayo ezidlala indima enkulu ekukhiqizeni i-chip.Ngaphezu kwalokho, kungase kube nezinye izici ezingase zicatshangelwe.Into ebaluleke kakhulu okufanele uyikhumbule lapho ulinganisela izindleko ze-IC ukuthi intengo ingahluka phakathi nenqubo yokukhiqiza ngezizathu eziningi.
Futhi, noma yiziphi izinqumo zobuchwepheshe ezithathwe phakathi nenqubo yokukhiqiza zingase zibe nomthelela omkhulu ezindlekweni zephrojekthi.
3. Ukwethembeka
Ukukhiqizwa kwamasekhethi ahlanganisiwe kuwumsebenzi obucayi kakhulu njengoba udinga ukuthi zonke izinhlelo zisebenze ngokuqhubekayo phakathi nezigidi zemijikelezo.Izinkambu zikagesi zangaphandle, amazinga okushisa aphakeme, nezinye izimo zokusebenza zonke zidlala indima ebalulekile ekusebenzeni kwe-IC.
Kodwa-ke, eziningi zalezi zinkinga ziqedwa ngokusetshenziswa kokuhlolwa kokucindezeleka okuphezulu okulawulwa kahle.Ayihlinzeki ngezindlela ezintsha zokuhluleka, okwandisa ukuthembeka kwamasekethe ahlanganisiwe.Singaphinda sinqume ukusatshalaliswa kokwehluleka ngesikhathi esifushane ngokusetshenziswa kokucindezeleka okuphezulu.
Zonke lezi zici zisiza ukuqinisekisa ukuthi isifunda esihlanganisiwe siyakwazi ukusebenza kahle.
Ngaphezu kwalokho, nazi ezinye izici zokunquma ukuziphatha kwamasekhethi ahlanganisiwe:
Izinga lokushisa
Izinga lokushisa lingase lihluke kakhulu, okwenza ukukhiqizwa kwe-IC kube nzima kakhulu.
Amandla kagesi.
Amadivayisi asebenza nge-voltage yegama engahluka kancane.
Inqubo
Izinguquko ezibaluleke kakhulu zenqubo ezisetshenziswa kumadivayisi yi-threshold voltage nobude besiteshi.Ukuhluka kwenqubo kuhlukaniswa ngokuthi:
- Okuningi kokuningi
- I-wafer kuya ku-wafer
- Kufa ukufa
Amaphakheji Esifunda Ahlanganisiwe
Iphakheji ihlanganisa ukufa kwesekethe ehlanganisiwe, okwenza kube lula ngathi ukuxhuma kuyo.Ukuxhumana ngakunye kwangaphandle kudayizi kuxhunywe nocezu oluncane lwentambo yegolide nephinikhodi ephaketheni.Amaphini angamatheminali aphumayo anombala osiliva.Badlula kumjikelezo ukuze baxhumane nezinye izingxenye ze-chip.Lezi zibaluleke kakhulu njengoba zizungeza isekethe futhi zixhuma ezintanjeni nakwezinye izingxenye zesekethe.
Kunezinhlobo eziningana ezahlukene zamaphakheji angasetshenziswa lapha.Zonke zinezinhlobo zokukhweza ezihlukile, ubukhulu obuhlukile, nezibalo zamaphini.Ake sibheke ukuthi lokhu kusebenza kanjani.
Ukubala kwephini
Wonke amasekethe ahlanganisiwe ane-polarized, futhi iphinikhodi ngayinye ihlukile ngokokubili ukusebenza nendawo.Lokhu kusho ukuthi iphakheji idinga ukukhombisa futhi ihlukanise zonke izikhonkwane komunye nomunye.Ama-IC amaningi asebenzisa ichashazi noma inotshi ukuze abonise iphinikhodi yokuqala.
Uma usuhlonze indawo yephinikhodi yokuqala, ezinye izinombolo zephinikhodi zikhula ngokulandelana njengoba uhamba ngokuphikisana newashi uzungeza isekethe.
Ukukhweza
Ukukhweza kungenye yezici ezihlukile zohlobo lwephakheji.Wonke amaphakheji angahlukaniswa njengokukodwa kwezigaba ezimbili zokukhweza: i-surface-mount (SMD noma i-SMT) noma i- through-hole (PTH).Kulula kakhulu ukusebenza ngamaphakheji e-Thry-hole ngoba makhudlwana.Zenzelwe ukuthi zilungiswe ngakolunye uhlangothi lwesekethe futhi zidayiswe kolunye.
Amaphakheji e-surface-mount afika ngosayizi abahlukene, kusukela kwabancane kuya kwabancane.Zihlanganiswe ohlangothini olulodwa lwebhokisi futhi zidayiswa phezulu.Izikhonkwane zale phakheji zingama-perpendicular to chip, ziminyaniswe eceleni, noma ngezinye izikhathi zisethwe ku-matrix esisekelweni se-chip.Amasekhethi ahlanganisiwe ngendlela ye-surface-mount nawo adinga amathuluzi akhethekile ukuze ahlanganiswe.
I-Dual In-Line
I-Dual In-line Package (DIP) ingelinye lamaphakheji ajwayeleke kakhulu.Lolu wuhlobo lwephakheji ye-IC yembobo.Lawa mashiphu amancane aqukethe imigqa emibili ehambisanayo yezikhonkwane enwebeka isuka kundlu emnyama, epulasitiki, engunxande.
Izikhonkwane zinezikhala ezicishe zibe ngu-2.54 mm phakathi kwazo - okuyizinga elifanele ukuze lingene kumabhodi onkwankwa namanye amabhodi ambalwa e-prototyping.Kuye ngesibalo sephinikhodi, ubukhulu bephakheji ye-DIP bungase buhluke ukusuka ku-4 ukuya ku-64.
Isifunda esiphakathi komugqa ngamunye wamaphini sihlukanisiwe ukuze sikwazi ukwenza ama-DIP IC adlulele endaweni emaphakathi yebhodi lezinkwa.Lokhu kuqinisekisa ukuthi izikhonkwane zinerowu yazo futhi azimfushane.
Uhlaka Oluncane
Amaphakheji esekethe ahlanganisiwe anehlaka elincane noma i-SOIC afana ne-surface-mount.Yakhiwe ngokugoba zonke izikhonkwane ku-DIP bese uyishwabanisa phansi.Ungakwazi ukuhlanganisa la maphakheji ngesandla esiqinile ngisho neso elivaliwe - Kulula lokho!
I-Quad Flat
Amaphakheji we-Quad Flat adlala izikhonkwane kuzo zonke izinhlangothi ezine.Ingqikithi yenani lamaphini ku-quad flat IC ingahluka noma kuphi ukusuka kumaphini ayisishiyagalombili ohlangothini (ingqikithi engu-32) ukuya kwezingamashumi ayisikhombisa ohlangothini (300+ isiyonke).Lawa maphini anesikhala esingaba ngu-0.4mm kuya ku-1mm phakathi kwawo.Izinhlobonhlobo ezincane zephakheji ye-quad flat zihlanganisa amaphakheji amancane (i-LQFP), amancane (TQFP), namaphakheji amancane kakhulu (VQFP).
I-Ball Grid Arrays
I-Ball Grid Arrays noma i-BGA amaphakheji e-IC athuthuke kakhulu nxazonke.Lawa ayinkimbinkimbi ngendlela emangalisayo, amaphakheji amancane lapho amabhola amancane e-solder ahlelwa khona kugridi enezinhlangothi ezimbili esisekelweni sesekethe ehlanganisiwe.Ngezinye izikhathi ochwepheshe banamathisela amabhola e-solder ngqo kufa!
Amaphakheji e-Ball Grid Arrays avame ukusetshenziselwa ama-microprocessors athuthukile, njenge-Raspberry Pi noma i-pcDuino.