Izingxenye ze-Semiconductors Electronic TPS7A5201QRGRRQ1 I-Ic Chips BOM Isevisi yokuthenga indawo eyodwa
Izimfanelo Zomkhiqizo
UHLOBO | DESCRIPTION |
Isigaba | Izifunda Ezihlanganisiwe (ICs) |
Mfr | Texas Instruments |
Uchungechunge | Ezezimoto, AEC-Q100 |
Iphakheji | I-Tape & Reel (TR) Cut Tape (CT) I-Digi-Reel® |
SPQ | 3000T&R |
Isimo somkhiqizo | Iyasebenza |
Ukucushwa Kokukhiphayo | Okuhle |
Uhlobo Lokukhiphayo | Kuyalungiseka |
Inombolo Yabalawuli | 1 |
I-Voltage - Okokufaka (Ubukhulu) | 6.5V |
I-Voltage - Okukhiphayo (Okuncane/Okulungisiwe) | 0.8V |
I-Voltage - Okukhiphayo (Ubukhulu) | 5.2V |
I-Voltage Dropout (Ubukhulu) | 0.3V @ 2A |
Okwamanje - Okukhiphayo | 2A |
I-PSRR | 42dB ~ 25dB (10kHz ~ 500kHz) |
Lawula izici | Nika amandla |
Izici Zokuvikela | Ngaphezulu Kwezinga Lokushisa, Reverse Polarity |
Izinga Lokushisa Lokusebenza | -40°C ~ 150°C (TJ) |
Uhlobo Lokukhweza | INtaba Engaphezulu |
Iphakheji / Ikesi | 20-VFQFN Iphedi Eveziwe |
Iphakheji Yedivayisi Yomhlinzeki | 20-VQFN (3.5x3.5) |
Inombolo Yomkhiqizo Eyisisekelo | I-TPS7A5201 |
Uhlolojikelele lwama-chips
(i) Yini i-chip
Isekethe ehlanganisiwe, efushanisiwe njenge-IC;noma i-microcircuit, i-microchip, i-chip iyindlela yokwenza amasekhethi amancane (ikakhulukazi amadivaysi e-semiconductor, kodwa futhi izingxenye ze-passive, njll.) kuma-electronics, futhi ngokuvamile akhiqizwa ebusweni be-semiconductor wafers.
(ii) Inqubo yokukhiqiza i-chip
Inqubo ephelele yokwenziwa kwe-chip ihlanganisa ukuklanywa kwe-chip, ukwenziwa kwe-wafer, ukwenziwa kwephakheji, nokuhlola, phakathi kwayo inqubo yokwenziwa kwe-wafer eyinkimbinkimbi kakhulu.
Okokuqala ukuklama kwe-chip, ngokwezidingo zokuklama, "iphethini" ekhiqizwayo, impahla eluhlaza ye-chip yi-wafer.
I-wafer yenziwe nge-silicon, ecwengisiswe esihlabathini se-quartz.I-wafer iyingxenye ye-silicon ehlanjululwe (99.999%), bese i-silicon ehlanzekile yenziwe ibe yizinduku ze-silicon, eziba yinto yokukhiqiza ama-semiconductors e-quartz yamasekethe ahlanganisiwe, anqunywe abe ama-wafer okukhiqiza ama-chip.Uma i-wafer iba mncane, izindleko zokukhiqiza ziyancipha, kodwa inqubo idinga kakhulu.
I-wafer enamathela
I-wafer coating imelana ne-oxidation nokumelana nezinga lokushisa futhi iwuhlobo lwe-photoresist.
Ukuthuthukiswa kwe-Wafer Photolithography kanye nokunamathisela
Ukugeleza okuyisisekelo kwenqubo ye-photolithography kuboniswa kumdwebo ongezansi.Okokuqala, ungqimba lwe-photoresist lusetshenziswa ebusweni be-wafer (noma i-substrate) bese yomiswa.Ngemuva kokumisa, i-wafer idluliselwa emshinini we-lithography.Ukukhanya kudluliselwa kumaski ukuze kuveze iphethini kumaski ku-photoresist endaweni eyi-wafer, okuvumela ukuchayeka futhi kuvuselele ukusabela kwe-photochemical.Amawafa aveziwe abe esebhakwa okwesibili, okwaziwa ngokuthi ukubhaka kwangemuva kokuchayeka, lapho ukusabela kwe-photochemical kuphelele kakhulu.Ekugcineni, unjiniyela ufafazwa ku-photoresist endaweni eyi-wafer ukuze athuthukise iphethini eveziwe.Ngemuva kokuthuthukiswa, iphethini kumaski ishiywe ku-photoresist.
Ukunamathisela, ukubhaka, nokuthuthukisa konke kwenziwa kunjiniyela we-screed futhi ukuchayeka kwenziwa ku-photolithograph.Unjiniyela we-screed kanye nomshini we-lithography ngokuvamile kusetshenziswa emgqeni, ama-wafer adluliswa phakathi kwamayunithi nomshini kusetshenziswa irobhothi.Lonke uhlelo lokuchayeka nokuthuthukisa luvaliwe futhi amawafa awavezwa ngokuqondile endaweni ezungezile ukuze kuncishiswe umthelela wezingxenye eziyingozi endaweni ku-photoresist kanye nokusabela kwe-photochemical.
Doping nokungcola
Ukutshala ama-ion ku-wafer ukukhiqiza ama-semiconductors ohlobo lwe-P no-N ahambisanayo.
Ukuhlolwa kwe-wafer
Ngemuva kwalezi zinqubo ezingenhla, kwakhiwa i-lattice yedayisi ku-wafer.Izici zikagesi zedayizi ngayinye ziyahlolwa kusetshenziswa iphinikhodi.
Ukupakisha
Ama-wafers akhiqiziwe alungisiwe, aboshwe ngezikhonkwane, futhi enziwa amaphakheji ahlukene ngokuvumelana nezidingo, yingakho i-chip core efanayo ingahlanganiswa ngezindlela ezahlukene.Isibonelo, i-DIP, i-QFP, i-PLCC, i-QFN, njalonjalo.Lapha kunqunywa ikakhulukazi imikhuba yohlelo lokusebenza yomsebenzisi, indawo yohlelo lokusebenza, ifomethi yemakethe, nezinye izici ezizungezile.
Ukuhlola, ukupakisha
Ngemuva kwenqubo engenhla, ukukhiqizwa kwe-chip kuqedile.Lesi sinyathelo siwukuhlola i-chip, ukususa imikhiqizo enesici bese uyipakisha.
Ubudlelwano phakathi kwama-wafers nama-chips
I-chip yenziwe ngamadivaysi angaphezu kweyodwa e-semiconductor.Ama-Semiconductors ngokuvamile ama-diode, ama-triode, amashubhu womphumela wensimu, ama-resistors amandla amancane, ama-inductors, ama-capacitor, njalonjalo.
Kuwukusetshenziswa kwezindlela zobuchwepheshe zokushintsha ukuhlangana kwama-electron amahhala kuyinucleus ye-athomu emthonjeni oyindilinga ukuze kushintshwe izici ezibonakalayo ze-nucleus ye-athomu ukuze kukhiqizwe ukushaja okuhle noma okungalungile kwabaningi (ama-electron) noma ambalwa (izimbobo) ukuze yakha ama-semiconductors ahlukahlukene.
I-silicon ne-germanium yizinto ezisetshenziswa kakhulu ze-semiconductor futhi izakhiwo zazo nezinto ezisetshenziswayo zitholakala kalula ngamanani amakhulu futhi ngezindleko eziphansi zokusetshenziswa kulobu buchwepheshe.
I-silicon wafer yenziwe ngenani elikhulu lamadivayisi we-semiconductor.Umsebenzi we-semiconductor, yiqiniso, ukwakha isekethe njengoba kudingekile nokuba khona ku-silicon wafer.