Isitoko esisha sangempela soqobo se-IC I-Electronic Components I-Ic Chip Support BOM Service TPS22965TDSGRQ1
Izimfanelo Zomkhiqizo
| UHLOBO | DESCRIPTION |
| Isigaba | Izifunda Ezihlanganisiwe (ICs) |
| Mfr | Texas Instruments |
| Uchungechunge | Ezezimoto, AEC-Q100 |
| Iphakheji | I-Tape & Reel (TR) Cut Tape (CT) I-Digi-Reel® |
| Isimo somkhiqizo | Iyasebenza |
| Shintsha Uhlobo | Inhloso Ejwayelekile |
| Inombolo Yemiphumela | 1 |
| Isilinganiso - Okokufaka:Okukhiphayo | 1:1 |
| Ukucushwa Kokukhiphayo | Uhlangothi Oluphezulu |
| Uhlobo Lokukhiphayo | Isiteshi se-N |
| Isixhumi esibonakalayo | Khanyisa cisha |
| I-Voltage - Layisha | 2.5V ~ 5.5V |
| I-Voltage - Supply (Vcc/Vdd) | 0.8V ~ 5.5V |
| Okwamanje - Okukhiphayo (Ubukhulu) | 4A |
| I-Rds On (Typ) | 16 mhm |
| Uhlobo Lokufaka | Okungaguquli |
| Izici | Ukukhipha Ukulayisha, Izinga Lokubulala Lilawulwa |
| Ukuvikelwa Kwephutha | - |
| Izinga Lokushisa Lokusebenza | -40°C ~ 105°C (TA) |
| Uhlobo Lokukhweza | INtaba Engaphezulu |
| Iphakheji Yedivayisi Yomhlinzeki | 8-WSON (2x2) |
| Iphakheji / Ikesi | 8-WFDFN Iphedi Eveziwe |
| Inombolo Yomkhiqizo Eyisisekelo | I-TPS22965 |
Kuyini ukupakisha
Ngemva kwenqubo ende, kusukela ekuklanyweni kuya ekukhiqizeni, ekugcineni uthola i-IC chip.Nokho, i-chip incane futhi izacile kangangokuba ingaklwejwa kalula futhi ilimale uma ingavikelekile.Ngaphezu kwalokho, ngenxa yobukhulu obuncane be-chip, akulula ukuyibeka ebhodini ngesandla ngaphandle kwendlu enkulu.
Ngakho-ke, incazelo yephakheji iyalandela.
Kunezinhlobo ezimbili zamaphakheji, iphakheji ye-DIP, evame ukutholakala kumathoyizi kagesi futhi ibukeka njenge-centipede emnyama, kanye nephakheji ye-BGA, evame ukutholakala lapho kuthengwa i-CPU ebhokisini.Ezinye izindlela zokupakisha zifaka i-PGA (I-Pin Grid Array; I-Pin Grid Array) esetshenziswa kuma-CPU asekuqaleni noma inguqulo eguquliwe ye-DIP, i-QFP (iphakethe lepulasitiki lesikwele esiyisikwele).
Ngenxa yokuthi kunezindlela eziningi ezahlukene zokupakisha, okulandelayo kuzochaza amaphakheji e-DIP kanye ne-BGA.
Amaphakheji endabuko abekezelele iminyaka
Iphakheji yokuqala ezokwethulwa yi-Dual Inline Package (DIP).Njengoba ubona esithombeni esingezansi, i-IC chip kule phakheji ibukeka njenge-centipede emnyama ngaphansi komugqa ophindwe kabili wezikhonkwane, okuhlaba umxhwele.Kodwa-ke, ngenxa yokuthi iningi lenziwe ngepulasitiki, umphumela wokukhipha ukushisa mubi futhi awukwazi ukuhlangabezana nezidingo zama-chips amanje anesivinini esikhulu.Ngalesi sizathu, iningi lama-IC asetshenziswa kule phakheji ama-chips ahlala isikhathi eside, njenge-OP741 kumdwebo ongezansi, noma ama-IC angadingi isivinini esikhulu futhi anama-chips amancane anama-vias ambalwa.
I-IC chip ngakwesobunxele yi-OP741, i-amplifier evamile yamandla kagesi.
I-IC ngakwesobunxele yi-OP741, i-voltage amplifier evamile.
Ngokuqondene nephakheji ye-Ball Grid Array (BGA), incane kunephakheji ye-DIP futhi ingangena kalula kumadivayisi amancane.Ngaphezu kwalokho, ngenxa yokuthi izikhonkwane zitholakala ngaphansi kwe-chip, izikhonkwane eziningi zensimbi zingakwazi ukufakwa uma kuqhathaniswa ne-DIP.Lokhu kuyenza ilungele ama-chips adinga inombolo enkulu yoxhumana nabo.Kodwa-ke, kubiza kakhulu futhi indlela yokuxhuma iyinkimbinkimbi, ngakho-ke isetshenziswa kakhulu emikhiqizweni ebiza kakhulu.
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