Izingxenye Ze-elekthronikhi I-IC Chips Isekhethi Edidiyelwe Isevisi ye-BOM TPS4H160AQPWPRQ1
Izimfanelo Zomkhiqizo
UHLOBO | DESCRIPTION |
Isigaba | Izifunda Ezihlanganisiwe (ICs) |
Mfr | Texas Instruments |
Uchungechunge | Ezezimoto, AEC-Q100 |
Iphakheji | I-Tape & Reel (TR) Cut Tape (CT) I-Digi-Reel® |
SPQ | 2000T&R |
Isimo somkhiqizo | Iyasebenza |
Shintsha Uhlobo | Inhloso Ejwayelekile |
Inombolo Yemiphumela | 4 |
Isilinganiso - Okokufaka:Okukhiphayo | 1:1 |
Ukucushwa Kokukhiphayo | Uhlangothi Oluphezulu |
Uhlobo Lokukhiphayo | Isiteshi se-N |
Isixhumi esibonakalayo | Khanyisa cisha |
I-Voltage - Layisha | 3.4V ~ 40V |
I-Voltage - Supply (Vcc/Vdd) | Akudingeki |
Okwamanje - Okukhiphayo (Ubukhulu) | 2.5A |
I-Rds On (Typ) | 165mhm |
Uhlobo Lokufaka | Okungaguquli |
Izici | Ifulegi lesimo |
Ukuvikelwa Kwephutha | Umkhawulo Wamanje (Okulungisiwe), Ukushisa Ngokweqile |
Izinga Lokushisa Lokusebenza | -40°C ~ 125°C (TA) |
Uhlobo Lokukhweza | INtaba Engaphezulu |
Iphakheji Yedivayisi Yomhlinzeki | 28-HTSSOP |
Iphakheji / Ikesi | 28-PowerTSSOP (0.173", 4.40mm Ububanzi) |
Inombolo Yomkhiqizo Eyisisekelo | I-TPS4H160 |
Ubudlelwano phakathi kwama-wafers nama-chips
I-chip yenziwe ngamadivayisi angaphezu kwe-N semiconductor Ama-semiconductors ngokuvamile ama-diode triodes field effect amashubhu amancane ama-resistors amandla ama-inductors capacitor njll.
Kuwukusetshenziswa kwezindlela zobuchwepheshe zokushintsha ukuhlangana kwama-electron amahhala kuyinucleus ye-athomu emthonjeni oyindilinga ukuze kushintshwe izici ezibonakalayo ze-nucleus ye-athomu ukuze kukhiqizwe ukushaja okuhle noma okungalungile kwabaningi (ama-electron) noma ambalwa (izimbobo) ukuze yakha ama-semiconductors ahlukahlukene.
I-silicon ne-germanium yizinto ezisetshenziswa kakhulu ze-semiconductor futhi izakhiwo zazo nezinto ezisetshenziswayo zitholakala kalula futhi zishibhile ngamanani amakhulu ukuze zisetshenziswe kulobu buchwepheshe.
I-silicon wafer yenziwe ngenani elikhulu lamadivayisi we-semiconductor.Umsebenzi we-wafer, yiqiniso, ukwakha isifunda kuma-semiconductors akhona ku-wafer njengoba kudingeka.
Ubudlelwano phakathi kwama-wafers nama-chips - mangaki ama-wafers aku-chip
Lokhu kuncike kusayizi wokufa kwakho, usayizi we-wafer yakho, kanye nezinga lesivuno.
Okwamanje, amawafa emboni abizwa ngokuthi 6", 12" noma 18" amafushane kububanzi obuyi-wafer, kodwa ama-intshi ayisilinganiso. Ububanzi bangempela be-wafer buhlukaniswe ngo-150mm, 300mm no-450mm, kanti u-12" ulingana no-305mm. , ngakho-ke ibizwa ngokuthi i-12" wafer ukuze kube lula.
I-wafer ephelele
Incazelo: I-wafer iyiwafa eboniswe esithombeni futhi yenziwe nge-silicon ehlanzekile (Si).I-wafer ucezu oluncane lwe-silicon wafer, eyaziwa ngokuthi i-die, epakishwa njenge-pellet.Iwafa equkethe i-wafer ye-Nand Flash, iwafa iyasikwa kuqala, bese ihlolwa bese ifa eliphelele, elizinzile, elinamandla agcwele liyakhishwa futhi lipakishwe ukuze kwakhe i-Nand Flash chip oyibona nsuku zonke.
Okusalayo ku-wafer kungase kube okungaqinile, konakaliswe kancane, futhi ngenxa yalokho akunamandla, noma konakaliswe ngokuphelele.Umkhiqizi wangempela, ngokucabangela ukuqinisekiswa kwekhwalithi, uzomemezela ukuthi abafile bafile futhi abachaze kahle njengezilahlwa zokulahlwa okuphelele.
Ubudlelwano phakathi kokufa ne-wafer
Ngemva kokusikwa kwefasi, iwafa yasekuqaleni iba yilokho okuboniswe esithombeni esingezansi, okuyi-Downgrade Flash Wafer esele.
I-wafer esikrinini
Lezi zinsalela zokufa zingamawafa asezingeni eliphansi.Ingxenye ekhishiwe, ingxenye emnyama, iyifa elifanelekayo futhi izopakishwa futhi yenziwe amapellets e-NAND aqediwe ngumkhiqizi wokuqala, kuyilapho ingxenye engafaneleki, ingxenye esele esithombeni, izolahlwa njengemvuthuluka.