Izimfanelo Zomkhiqizo

Izindleko kube ngenye yezinkinga ezinkulu ezibhekene nama-chips apakishwe e-3D, futhi uFoveros kuzoba ngokokuqala ngqa ukuthi i-Intel iwakhiqize ngevolumu ephezulu ngenxa yobuchwepheshe bayo bokupakisha obuhamba phambili.I-Intel, nokho, ithi ama-chips akhiqizwe kumaphakheji we-3D Foveros ancintisana kakhulu ngentengo nemiklamo ejwayelekile ye-chip - futhi kwezinye izimo angase ashibhile.

I-Intel iklame i-chip ye-Foveros ukuthi ibe nezindleko eziphansi ngangokunokwenzeka futhi isahlangabezana nemigomo yokusebenza yenkampani eshiwo - iyi-chip eshibhe kakhulu ephaketheni le-Meteor Lake.I-Intel ayikabelani ngesivinini se-Foveros interconnect / base tile kodwa ithe izingxenye zingasebenza kuma-GHz ambalwa 'ngokucushwa kwe-passive (isitatimende esisho ukuba khona kwenguqulo esebenzayo yongqimba lomlamuli i-Intel eseyathuthuka. ).Ngakho-ke, i-Foveros ayidingi ukuthi umklami ayekethise ku-bandwidth noma izithiyo ze-latency.

I-Intel futhi ilindele ukuthi idizayini ikhule kahle ngokokubili ukusebenza nezindleko, okusho ukuthi inganikeza imiklamo ekhethekile yezinye izingxenye zemakethe, noma okuhlukile kwenguqulo esebenza kahle kakhulu.

Izindleko zama-node asethuthukile nge-transistor ngayinye zikhula kakhulu njengoba izinqubo ze-silicon chip zisondela emikhawulweni yazo.Futhi ukuklama amamojula amasha e-IP (njengezixhumanisi ze-I/O) zamanodi amancane akunikezeli imbuyiselo eningi ekutshalweni kwezimali.Ngakho-ke, ukusebenzisa kabusha amathayela/ama-chiplet angabalulekile kumanodi akhona 'okwanele' kungonga isikhathi, izindleko, nezinsiza zokuthuthukisa, ingasaphathwa eyokukwenza kube lula inqubo yokuhlola.

Kuma-chips awodwa, i-Intel kufanele ihlole izakhi ze-chip ezihlukile, njengememori noma i-PCIe interfaces, ngokulandelana, okungase kube inqubo edla isikhathi.Ngokuphambene, abakhiqizi bama-chip bangaphinda bahlole ama-chips amancane kanyekanye ukuze wonge isikhathi.amakhava nawo anenzuzo ekudizayineni ama-chips ezinhlotsheni ezithile ze-TDP, njengoba abaklami bengakwazi ukwenza ngendlela oyifisayo ama-chips amancane ukuze avumelane nezidingo zabo zedizayini.

Iningi lala maphuzu lizwakala lijwayelekile, futhi wonke ayizici ezifanayo eziholele i-AMD yehle endleleni ye-chipset ngo-2017. I-AMD yayingeyena owokuqala ukusebenzisa imiklamo esekelwe ku-chipset, kodwa yaba ngumkhiqizi wokuqala omkhulu ukusebenzisa le filosofi yokuklama akhiqiza ama-chips esimanje ngobuningi, into ethi i-Intel ibonakala sengathi ifike sekwephuze kakhulu.Kodwa-ke, ubuchwepheshe bokupakisha be-Intel obuhlongozwayo be-3D buyinkimbinkimbi kakhulu kunomklamo osuselwe kungqimba we-organic we-AMD, onakho kokubili okuhle nokubi.

Umehluko ekugcineni uzobonakala kuma-chips aqediwe, i-Intel ithi i-chip entsha ye-3D estakiwe i-Meteor Lake kulindeleke ukuthi itholakale ngo-2023, i-Arrow Lake ne-Lunar Lake iza ngo-2024.

I-Intel iphinde yathi i-Ponte Vecchio supercomputer chip, ezoba nama-transistors angaphezu kwezigidi eziyizinkulungwane eziyi-100, kulindeleke ukuthi ibe senhliziyweni ye-Aurora, i-supercomputer eshesha kakhulu emhlabeni.