Izimfanelo Zomkhiqizo

I-Intel yembula imininingwane ye-chip ye-3D: ekwazi ukupakisha ama-transistors ayizigidi eziyizinkulungwane eziyi-100, ihlela ukwethula ngo-2023

I-chip ye-3D estakiwe iyindlela entsha ye-Intel yokuphonsela inselelo uMthetho ka-Moore ngokupakisha izingxenye ezinengqondo ku-chip ukukhulisa ngokumangalisayo ukuminyana kwama-CPU, ama-GPU, namaphrosesa e-AI.Njengoba izinqubo ze-chip seziseduze nokuma, lokhu kungase kube ukuphela kwendlela yokuqhubeka nokuthuthukisa ukusebenza.

Muva nje, i-Intel yethule imininingwane emisha yokwakheka kwe-chip ye-3D Foveros ye-Meteor Lake ezayo, i-Arrow Lake, nama-Lunar Lake chips engqungqutheleni yemboni ye-semiconductor Hot Chips 34.

Amahemuhemu akamuva aphakamise ukuthi i-Intel's Meteor Lake izobambezeleka ngenxa yesidingo sokushintsha i-Intel's GPU tile/chipset isuke ku-TSMC 3nm node iye endaweni engu-5nm.Yize i-Intel isengakabelani ngolwazi mayelana nendawo ethile ezoyisebenzisela i-GPU, ummeleli wenkampani uthe indawo ehleliwe yengxenye ye-GPU ayikashintshi nokuthi iphrosesa isendleleni yokukhululwa ngesikhathi ngo-2023.

Ngokuphawulekayo, kulokhu i-Intel izokhiqiza kuphela enye yezingxenye ezine (ingxenye ye-CPU) esetshenziselwa ukwakha ama-chips ayo e-Meteor Lake - i-TSMC izokhiqiza ezinye ezintathu.Imithombo yemboni ikhomba ukuthi ithayela le-GPU yi-TSMC N5 (inqubo ye-5nm).

I-Intel yabelane ngezithombe zakamuva zephrosesa ye-Meteor Lake, ezosebenzisa i-Intel's 4 process node (inqubo engu-7nm) futhi izoqale ifinyelele emakethe njengeprosesa yeselula enama-cores ayisithupha amakhulu nama-cores amabili amancane.Ama-chips e-Meteor Lake kanye ne-Arrow Lake amboza izidingo zemakethe ye-PC ephathwayo neyedeskithophu, kuyilapho i-Lunar Lake izosetshenziswa ezincwadini zokubhalela ezincane nezilula, ezimboza imakethe engu-15W nangaphansi.

Intuthuko ekufakweni nasekuxhumaneni kushintsha ngokushesha ubuso bamaphrosesa esimanje.Kokubili manje sekubaluleke njengobuchwepheshe be-node yenqubo eyisisekelo - futhi ngokungangabazeki kubaluleke kakhulu ngezindlela ezithile.

Okuningi okudalulwe yi-Intel ngoMsombuluko kugxile kubuchwepheshe bayo bokufaka be-3D Foveros, obuzosetshenziswa njengesisekelo se-Meteor Lake, i-Arrow Lake, kanye ne-Lunar Lake processors emakethe yabathengi.Lobu buchwepheshe buvumela i-Intel ukuthi ibeke phezulu ama-chips amancane ku-chip yesisekelo esihlanganisiwe ene-Foveros interconnects.I-Intel futhi isebenzisa i-Foveros kuma-GPU ayo e-Ponte Vecchio kanye ne-Rialto Bridge kanye ne-Agilex FPGAs, ngakho-ke bungabhekwa njengobuchwepheshe obuyisisekelo bemikhiqizo eminingana yesizukulwane esilandelayo senkampani.

I-Intel ike yaletha i-3D Foveros ukuthi imakethe kuma-processor ayo e-Lakefield anevolumu ephansi, kodwa i-Meteor Lake engu-4-tile kanye ne-Ponte Vecchio ecishe ibe ngamathayela angama-50 ama-chips okuqala enkampani ukukhiqizwa ngobuningi ngobuchwepheshe.Ngemuva kwe-Arrow Lake, i-Intel izoshintshela ekuxhumekeni okusha kwe-UCI, okuzoyivumela ukuthi ingene ku-chipset ecosystem isebenzisa isixhumi esibonakalayo esijwayelekile.

I-Intel iveze ukuthi izobeka ama-chipsets e-Meteor Lake amane (abizwa ngokuthi “ama-tile/tiles” ngolimi lwe-Intel) phezu kwe-passive Foveros ungqimba/isisekelo esimaphakathi.Ithayela eliyisisekelo ku-Meteor Lake lihlukile kunalelo eseLakefield, elingathathwa njenge-SoC ngomqondo othile.Ubuchwepheshe bokupakisha be-3D Foveros buphinde busekele isendlalelo esiphakathi esisebenzayo.I-Intel ithi isebenzisa inqubo ye-22FFL eshibhile futhi enamandla aphansi (efana neLakefield) ukwenza ungqimba lwe-Foveros interposer.I-Intel iphinde inikeze okuhlukile kwe-'Intel 16′ yale node ngezinsizakalo zayo zokusungula, kodwa akucaci ukuthi iyiphi inguqulo ye-Meteor Lake base base tile Intel ezosebenzisa.

I-Intel izofaka amamojula ekhompuyutha, amabhulokhi e-I/O, amabhulokhi e-SoC, namabhulokhi wezithombe (GPUs) isebenzisa izinqubo ze-Intel 4 kulesi sendlalelo esimaphakathi.Wonke lawa mayunithi aklanywe yi-Intel futhi asebenzisa i-Intel architecture, kodwa i-TSMC izoba yi-OEM i-I/O, i-SoC, ne-GPU amabhulokhi kuwo.Lokhu kusho ukuthi i-Intel izokhiqiza amabhulokhi we-CPU namaFoveros kuphela.

Imithombo yemboni iyavuza ukuthi i-I/O die kanye ne-SoC zenziwa ngenqubo ye-TSMC ye-N6, kuyilapho i-tGPU isebenzisa i-TSMC N5.(Kuyaphawuleka ukuthi i-Intel ibhekisela kuthayela le-I/O njenge-'I/O Expander', noma i-IOE)

Ama-node esikhathi esizayo kumephu yomgwaqo we-Foveros afaka ama-25 kanye ne-18-micron pitches.I-Intel ithi kungenzeka ngokomqondo ukuzuza isikhala se-1-micron bump esikhathini esizayo usebenzisa i-Hybrid Bonded Interconnects (HBI).