I-Electronic ic chip Isekela Isevisi ye-BOM TPS54560BDDAR izingxenye ze-electronic zama-ic chips ezintsha

1.Ukuqanjwa kwe-IC, ulwazi olujwayelekile lwephakheji kanye nemithetho yokuqamba:

Ibanga lokushisa.

C=0°C kuya ku-60°C (ibanga lezentengiso);I=-20°C kuya ku-85°C (ibanga lezimboni);E=-40°C kuya ku-85°C (ibanga lezimboni elandisiwe);A=-40°C kuya ku-82°C (ibanga le-aerospace);M=-55°C kuya ku-125°C (ibanga lezempi)

Uhlobo lwephakheji.

A-SSOP;B-CERQUAD;C-TO-200, TQFP;I-D-Ceramic yethusi phezulu;I-E-QSOP;I-F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;I-N-Narrow DIP;N-DIP;Q PLCC;R - I-Narrow Ceramic DIP (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - I-Wide Small Form Factor (300mil) W-Wide ifomu elincane lesici (300 mil);I-X-SC-60 (3P, 5P, 6P);Y-Narrow phezulu yethusi;Z-TO-92, MQUAD;D-Die;/ Ipulasitiki eqiniswe nge-PR;/W-Wafer.

Inombolo yezikhonkwane:

a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;i -4;H-4;I-28;J-2;I-K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (umjikelezo);W-10 (umjikelezo);X-36;Y-8 (umjikelezo);Z-10 (umjikelezo).(umjikelezo).

Qaphela: Uhlamvu lokuqala lwezijobelelo zezinhlamvu ezine zekilasi lesixhumi esibonakalayo ngu-E, okusho ukuthi idivayisi inomsebenzi we-antistatic.

2.Ukuthuthukiswa kobuchwepheshe bokupakisha

Amasekethe okuqala ahlanganisiwe asebenzisa amaphakheji e-ceramic flat, aqhubeka esetshenziswa amasosha iminyaka eminingi ngenxa yokuthembeka kwawo kanye nosayizi omncane.Ukupakishwa kwesekethe yezentengiso ngokushesha kwashintshela kumaphakeji akulayini akabili, aqala nge-ceramic kwase kuba yipulasitiki, futhi ngeminyaka yawo-1980 isibalo samaphinikhodi we-VLSI seqa imikhawulo yokusetshenziswa kwamaphakheji e-DIP, ekugcineni kwaholela ekuveleni kwama-pin grid array kanye nabathwali bama-chip.

Iphakethe le-surface Mount yavela ekuqaleni kwawo-1980 futhi yaduma engxenyeni yakamuva yaleyo minyaka eyishumi.Isebenzisa iphinikhodi ecolekile futhi inomumo wephini omise okwe-J.I-Small-Outline Integrated Circuit (SOIC), isibonelo, inendawo encane ngo-30-50% futhi inogqinsi olungaphansi ngo-70% kune-DIP efanayo.Le phakheji inezikhonkwane ezimise okwe-gull eziphuma ezinhlangothini ezimbili ezinde kanye nephinikhodi engu-0.05".

I-Small-Outline Integrated Circuit (SOIC) namaphakheji e-PLCC.ngawo-1990, nakuba iphakheji ye-PGA yayisasetshenziselwa ama-microprocessors aphezulu.i-PQFP kanye nephakheji encane yohlaka oluncane (i-TSOP) ibe iphakheji evamile yamadivayisi wokubala amaphini aphezulu.Ama-microprocessors e-Intel kanye ne-AMD asezingeni eliphezulu asuke kumaphakheji e-PGA (Pine Grid Array) aya kumaphakheji we-Land Grid Array (LGA).

Amaphakheji e-Ball Grid Array aqala ukuvela ngeminyaka yawo-1970, futhi ngeminyaka yawo-1990 iphakheji ye-FCBGA yathuthukiswa ngenani lamaphinikhodi aphezulu kunamanye amaphakheji.Kuphakheji ye-FCBGA, idayi iyaphendulwa phezulu naphansi futhi ixhunywe kumabhola e-solder ephaketheni ngongqimba oluyisisekelo olufana ne-PCB kunezintambo.Emakethe yanamuhla, ukupakishwa manje sekuyingxenye ehlukile yenqubo, futhi ubuchwepheshe bephakheji bungathinta ikhwalithi kanye nesivuno somkhiqizo.