Isingeniso senqubo ye-wafer Back Grinding
1. Inhloso Yokugaya Emuva
Enqubweni yokwenza ama-semiconductors kusuka kuma-wafers, ukubukeka kwama-wafers kuhlale kushintsha.Okokuqala, enqubweni yokukhiqiza i-wafer, i-Edge nengaphezulu le-wafer kuyapholishwa, inqubo evame ukugaya izinhlangothi zombili ze-wafer.Ngemuva kokuphela kwenqubo yokuphela, ungaqala inqubo yokugaya ngemuva egaya kuphela ngemuva kwe-wafer, engasusa ukungcoliswa kwamakhemikhali enqubweni yangaphambili futhi yehlise ubukhulu be-chip, efaneleka kakhulu. ukukhiqizwa kwama-chips amancane afakwe emakhadini e-IC noma kumadivayisi eselula.Ngaphezu kwalokho, le nqubo inezinzuzo zokunciphisa ukumelana, ukunciphisa ukusetshenziswa kwamandla, ukwandisa ukuqhutshwa kwe-thermal kanye nokukhipha ukushisa ngokushesha ngemuva kwe-wafer.Kodwa ngesikhathi esifanayo, ngenxa yokuthi i-wafer incane, kulula ukuphulwa noma ukusonteka amandla angaphandle, okwenza isinyathelo sokucubungula sibe nzima nakakhulu.
2. Ukugaya Emuva (Ukugaya Emuva) inqubo enemininingwane
Ukugaya emuva kungahlukaniswa ngezinyathelo ezintathu ezilandelayo: okokuqala, namathisela i-Tape Lamination yokuzivikela ku-wafer;Okwesibili, gaya ngemuva kwesinkwa esilucwecwana;Okwesithathu, ngaphambi kokuhlukanisa i-chip ku-Wafer, i-wafer idinga ukubekwa ku-Wafer Mounting evikela i-tape.Inqubo ye-wafer patch yisiteji sokulungiselela ukuhlukanisachip(ukusika i-chip) ngakho-ke kungabuye kufakwe enqubweni yokusika.Eminyakeni yakamuva, njengoba ama-chips eba mancane, ukulandelana kwenqubo nakho kungashintsha, futhi izinyathelo zenqubo ziye zaba ngcono kakhulu.
3. Inqubo ye-Tape Lamination yokuvikelwa kwe-wafer
Isinyathelo sokuqala ekugayeni emuva yi-coating.Lena inqubo yokumboza enamathisela itheyiphu ngaphambili kwe-wafer.Uma ugaya ngemuva, izinhlanganisela ze-silicon zizosabalala nxazonke, futhi i-wafer ingase iphinde iqhekeke noma igoqe ngenxa yamandla angaphandle phakathi nale nqubo, futhi indawo enkulu ye-wafer, isengozini kakhulu kulo mkhuba.Ngakho-ke, ngaphambi kokugaya umhlane, ifilimu eliluhlaza elincanyana i-Ultra Violet (UV) linamathiselwe ukuvikela isinkwa esilucwecwana.
Uma usebenzisa ifilimu, ukuze ungenzi igebe noma ama-bubbles emoyeni phakathi kwe-wafer ne-tape, kuyadingeka ukwandisa amandla okunamathela.Kodwa-ke, ngemva kokugaya ngemuva, i-tape e-wafer kufanele ikhanyise ukukhanya kwe-ultraviolet ukunciphisa amandla okunamathela.Ngemuva kokukhumula, insalela ye-tape akufanele ihlale endaweni eyi-wafer.Ngezinye izikhathi, le nqubo izosebenzisa ukunamathela obuthakathaka futhi othambekele ukuba bubble non-ultraviolet yokunciphisa ulwelwesi ukwelashwa, nakuba eminingi yokuntula, kodwa engabizi.Ngaphezu kwalokho, amafilimu e-Bump, anogqinsi oluphindwe kabili njengolwelwesi lokunciphisa i-UV, nawo asetshenziswa, futhi kulindeleke ukuthi asetshenziswe ngokukhula kwemvamisa esikhathini esizayo.
4. Ugqinsi lwe-wafer luhambisana ngokuphambene nephakheji ye-chip
Ugqinsi lwe-wafer ngemva kokugaya ingemuva ngokuvamile luyehliswa lusuka ku-800-700 µm luye ku-80-70 µm.Ama-wafers ancishiswe aze afike kweshumi anganqwabelanisa izingqimba ezine kuya kweziyisithupha.Muva nje, ama-wafers angancishiswa abe amamilimitha angaba ngu-20 ngenqubo yokugaya kabili, ngaleyo ndlela anqwabelene azendlalelo angu-16 kuya kwangu-32, isakhiwo se-semiconductor enezingqimba eziningi esaziwa ngokuthi i-multi-chip package (MCP).Kulesi simo, naphezu kokusetshenziswa kwezingqimba eziningi, ukuphakama okuphelele kwephakheji eliqediwe akufanele kudlule ubukhulu obuthile, yingakho ama-wafers okugaya amancane ahlala elandelwa.Uma i-wafer iba mncane, kuba namaphutha amaningi, futhi kuba nzima kakhulu inqubo elandelayo.Ngakho-ke, ubuchwepheshe obuphambili buyadingeka ukuze kuthuthukiswe le nkinga.
5. Ukushintsha indlela yokugaya emuva
Ngokusika ama-wafers abe mncane ngangokunokwenzeka ukuze unqobe imikhawulo yamasu okucubungula, ubuchwepheshe bokugaya ngemuva buyaqhubeka nokuvela.Kumawafa avamile anogqinsi olungu-50 noma ngaphezulu, Ukugaya ngemuva kuhilela izinyathelo ezintathu: Ukugaya Okumahhadla kanye Nokugaya Okuhle, lapho i-wafer isikwa futhi ipholishwe ngemva kwezikhathi ezimbili zokugaya.Kuleli qophelo, okufana ne-Chemical Mechanical Polishing (CMP), Amanzi E-Slurry kanye Ne-Deionized ngokuvamile asetshenziswa phakathi kwephedi yokupholisha kanye ne-wafer.Lo msebenzi wokupholisha unganciphisa ukungqubuzana phakathi kwewafa nephedi yokupholisha, futhi wenze ubuso bukhanye.Uma i-wafer isijiyile, i-Super Fine Grinding ingasetshenziswa, kodwa uma i-wafer ibe mncane, kudingeka ukupholishwa okwengeziwe.
Uma i-wafer iba mncane, ijwayele ukukhubazeka kwangaphandle ngesikhathi sokusika.Ngakho-ke, uma ubukhulu bewafa bungama-50 µm noma ngaphansi, ukulandelana kwenqubo kungashintshwa.Ngalesi sikhathi, kusetshenziswa indlela ye-DBG (Dicing Before Grinding), okungukuthi, i-wafer inqunywa phakathi ngaphambi kokugaya kokuqala.I-chip ihlukaniswa ngokuphephile ku-wafer ngohlelo Loku-Dicing, ukugaya, nokusikwa.Ngaphezu kwalokho, kunezindlela ezikhethekile zokugaya ezisebenzisa ipuleti eliqinile lengilazi ukuvimbela i-wafer ukuthi ingaphuli.
Ngokukhula kwesidingo sokuhlanganiswa ku-miniaturization yemishini kagesi, ubuchwepheshe bokugaya i-backside akufanele bunqobe ukulinganiselwa kwabo kuphela, kodwa futhi buqhubeke nokuthuthukisa.Ngesikhathi esifanayo, akudingekile kuphela ukuxazulula inkinga ye-defect ye-wafer, kodwa futhi ukulungiselela izinkinga ezintsha ezingase zivele esikhathini esizayo.Ukuze kuxazululwe lezi zinkinga, kungase kudingekeshintshaukulandelana kwenqubo, noma ukwethula ubuchwepheshe bokufaka amakhemikhali obusetshenziswa kui-semiconductorinqubo ye-front-end, futhi uthuthukise ngokugcwele izindlela ezintsha zokucubungula.Ukuze kuxazululwe izinkinga ezingokwemvelo zama-wafers wendawo enkulu, kubhekwa izindlela ezihlukahlukene zokugaya.Ngaphezu kwalokho, ucwaningo luyenziwa mayelana nendlela yokuvuselela i-silicon slag ekhiqizwa ngemva kokugaya ama-wafers.
Isikhathi sokuthumela: Jul-14-2023