I-IC XCKU025-1FFVA1156I yoqobo I-Chip Isekhethi Ehlanganisiwe IC FPGA 312 I/O 1156FCBGA

I-IC XCKU025-1FFVA1156I I-Chip Ehlanganisiwe Ye-Circuit IC FPGA 312 I/O 1156FCBGA Isithombe Esifakiwe

incazelo emfushane:

I-Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA、FCBGA

Thumela i-imeyili kithi Landa i-Datesheet

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izimfanelo Zomkhiqizo

UHLOBO	IFANEKISA
isigaba	Izifunda Ezihlanganisiwe (ICs) Kushumekiwe I-Field Programmable Gate Arrays (FPGAs)
umkhiqizi	I-AMD
uchungechunge	I-Kintex® UltraScale™
ukugoqa	inqwaba
Isimo somkhiqizo	Iyasebenza
I-DigiKey iyahleleka	Akuqinisekisiwe
Inombolo ye-LAB/CLB	18180
Inani lezinto ezinengqondo/amayunithi	318150
Isamba senani lamabhithi e-RAM	13004800
Inombolo yama-I/Os	312
I-Voltage - Ukunikezwa kwamandla	0.922V ~ 0.979V
Uhlobo lokufaka	Uhlobo lwe-adhesive ebusweni
Izinga lokushisa lokusebenza	-40°C ~ 100°C (TJ)
Iphakheji/Izindlu	1156-BBGA,I-FCBGA
I-encapsulation yengxenye yomthengisi	1156-FCBGA (35x35)
Inombolo enkulu yomkhiqizo	I-XCKU025

Amadokhumenti Nemidiya

UHLOBO LOKUSEBENZA	LINK
Ishidi le-data	I-Kintex® UltraScale™ FPGA Datasheet
Ulwazi lwezemvelo	I-Xiliinx RoHS Cert I-Xilinx REACH211 Cert
Idizayini/ukucaciswa kwe-PCN	I-Ultrascale & Virtex Dev Spec Chg 20/Dec/2016

Ukuhlukaniswa kwemininingwane yezemvelo kanye nokuthekelisa ngaphandle

ISIQINISEKISO	IFANEKISA
Isimo se-RoHS	Ihambisana nomyalelo we-ROHS3
Ileveli Yokuzwela Ukuswakama (MSL)	4 (amahora angama-72)
REACH isimo	Akukho ngaphansi kokucaciswa kwe-REACH
ECCN	3A991D
HTSUS	8542.39.0001

Isingeniso Somkhiqizo

I-FCBGA(I-Flip Chip Ball Grid Array) imele "i-flip chip ball grid Array".

I-FC-BGA(I-Flip Chip Ball Grid Array), ebizwa ngefomethi yephakheji yephakheji ye-flip chip ball, futhi iyifomethi yephakheji ebaluleke kakhulu yama-chips asheshiswayo wezithombe njengamanje.Lobu buchwepheshe bokupakisha baqala ngeminyaka yawo-1960, lapho i-IBM isungula ubuchwepheshe obubizwa nge-C4(Controlled Collapse Chip Connection) bokuhlanganisa amakhompyutha amakhulu, yase ithuthukiswa kakhulu ukusebenzisa ukushuba kwesimo esincibilikisiwe ukusekela isisindo se-chip. futhi ulawule ukuphakama kweqhubu.Futhi ube isiqondiso sokuthuthukiswa kobuchwepheshe be-flip.

Yiziphi izinzuzo ze-FC-BGA?

Okokuqala, iyaxazululaukuhambisana kwe-electromagnetic(EMC) kanyeukuphazamiseka kwe-electromagnetic (EMI)izinkinga.Ngokuvamile, ukudluliswa kwesignali kwe-chip kusetshenziswa ubuchwepheshe bokupakisha be-WireBond kwenziwa ngocingo lwensimbi olunobude obuthile.Endabeni yemvamisa ephezulu, le ndlela izokhiqiza lokho okubizwa ngokuthi umphumela we-impedance, okwenza isithiyo kumzila wesignali.Nokho, i-FC-BGA isebenzisa ama-pellets esikhundleni samaphini ukuze ixhume iphrosesa.Le phakheji isebenzisa ingqikithi yamabhola angu-479, kodwa ngalinye linobubanzi obungu-0.78 mm, okunikeza ibanga elifushane kakhulu lokuxhuma ngaphandle.Ukusebenzisa le phakheji akuhlinzeki nje ngokusebenza kahle kakhulu kukagesi, kodwa futhi kunciphisa ukulahlekelwa kanye ne-inductance phakathi kokuxhumana kwengxenye, kunciphisa inkinga yokuphazanyiswa kwe-electromagnetic, futhi kungakwazi ukumelana namaza aphezulu, ukwephula umkhawulo we-overclocking kungenzeka.

Okwesibili, njengoba abaklami be-chip bashumeka amasekhethi aminyene kakhulu endaweni efanayo ye-silicon crystal, inani lamatheminali namaphinikhodi okokufaka nokukhiphayo lizokhula ngokushesha, futhi enye inzuzo ye-FC-BGA ukuthi ingakhuphula ukuminyana kwe-I/O. .Ngokuvamile, i-I/O ehamba phambili esebenzisa ubuchwepheshe be-WireBond ihlelwa eduze kwe-chip, kodwa ngemva kwephakheji ye-FC-BGA, imikhondo ye-I/O ingahlelwa ngohlelo ebusweni be-chip, inikeze ukuminyana okuphezulu kwe-I/O. isakhiwo, okuholela ekusebenzeni kahle kokusetshenziswa, futhi ngenxa yale nzuzo.Ubuchwepheshe be-Inversion bunciphisa indawo ngo-30% kuya ku-60% uma kuqhathaniswa namafomu okupakisha endabuko.

Ekugcineni, esizukulwaneni esisha se-high-speed, ama-chips wokubonisa ahlanganiswe kakhulu, inkinga yokushisa ukushisa kuyoba inselele enkulu.Ngokusekelwe kufomu lephakheji eliphendukile eliyingqayizivele le-FC-BGA, ingemuva le-chip lingachayeka emoyeni futhi lingakhipha ukushisa ngokuqondile.Ngesikhathi esifanayo, i-substrate ingase futhi ithuthukise ukusebenza kahle kokukhipha ukushisa ngongqimba lwensimbi, noma ifake usinki wokushisa wensimbi ngemuva kwe-chip, iqinise nakakhulu ikhono lokukhipha ukushisa kwe-chip, futhi ithuthukise kakhulu ukuzinza kwe-chip. ekusebenzeni ngesivinini esikhulu.

Ngenxa yezinzuzo zephakheji ye-FC-BGA, cishe wonke ama-chips amakhadi okusheshisa ihluzo ahlanganiswe ne-FC-BGA.

Okwedlule: I-XC7VX485T-2FFG1761I Virtex®-7 T kanye ne-XT FPGAs atholakala ku--3, -2, -1, kanye -2L amamaki esivinini RoHS Compliant

Olandelayo: XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104

Bhala umyalezo wakho lapha futhi usithumelele wona