XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104
Ulwazi Lomkhiqizo
| TYPENo.ye-Logic Blocks: | 2586150 |
| Inombolo yama-Macrocell: | 2586150Ama-Macrocell |
| Umndeni we-FPGA: | Uchungechunge lwe-Virtex UltraScale |
| Isitayela sekesi elinengqondo: | I-FCBGA |
| Inombolo yamaphini: | 2104 Izikhonkwane |
| Inombolo Yamabanga Esivinini: | 2 |
| Isamba samabhithi e-RAM: | 77722Kbit |
| Inombolo ye-I/O's: | 778I/O |
| Ukuphathwa Kwewashi: | MMCM, PLL |
| I-Core Supply Voltage Min: | 922mV |
| I-Core Supply Voltage Max: | 979mv |
| I/O Supply Voltage: | 3.3V |
| I-Operating Frequency Max: | 725MHz |
| Ibanga Lomkhiqizo: | I-Virtex UltraScale XCVU9P |
| I-MSL: | - |
Isingeniso Somkhiqizo
I-BGA imeleIphakheji ye-Ball Grid Q Array.
Inkumbulo ehlanganiswe ubuchwepheshe be-BGA ingakhuphula umthamo wenkumbulo izikhathi ezintathu ngaphandle kokushintsha ivolumu yememori, i-BGA ne-TSOP
Uma kuqhathaniswa, inomthamo omncane, ukusebenza okungcono kokukhipha ukushisa nokusebenza kukagesi.Ubuchwepheshe bokupakisha be-BGA buye bathuthukisa kakhulu umthamo wokugcina nge-intshi yesikwele, kusetshenziswa imikhiqizo yenkumbulo yobuchwepheshe be-BGA ngaphansi komthamo ofanayo, ivolumu iyingxenye eyodwa kwezintathu kuphela yokupakishwa kwe-TSOP;Futhi, ngesiko
Uma kuqhathaniswa nephakheji ye-TSOP, iphakheji ye-BGA inendlela esheshayo nesebenza ngempumelelo yokukhipha ukushisa.
Ngokuthuthukiswa kobuchwepheshe besekethe edidiyelwe, izidingo zokupakishwa zamasekethe ahlanganisiwe ziqine kakhulu.Lokhu kungenxa yokuthi ubuchwepheshe bokupakisha buhlobene nokusebenza komkhiqizo, lapho imvamisa ye-IC idlula u-100MHz, indlela yokupakisha evamile ingase ikhiqize lokho okubizwa nge-"Cross Talk• phenomenon, futhi uma inombolo yezikhonkwane ze-IC ezingaphezu kuka-208 Pin, indlela yokupakisha evamile inobunzima bayo. Ngakho-ke, ngaphezu kokusetshenziswa kwephakheji ye-QFP, ama-chips amaningi anamuhla wokubala amaphini (njengama-graphic chips nama-chipset, njll.) ashintshelwa ku-BGA(Ball Grid Array). PackageQ) ubuchwepheshe bokupakisha. Lapho i-BGA ivela, yaba ukukhetha okungcono kakhulu kokuminyana okuphezulu, ukusebenza okuphezulu, amaphakheji amaphini amaningi afana ne-cpus kanye nama-chips ebhuloho aseningizimu/eNyakatho kumabhodi omama.
Ubuchwepheshe bokupakisha be-BGA bungahlukaniswa ngezigaba ezinhlanu:
I-1.PBGA (Plasric BGA) substrate: Ngokuvamile izingqimba ezingu-2-4 zezinto eziphilayo ezakhiwe ngebhodi lezingqimba eziningi.Intel uchungechunge CPU, Pentium 1l
Amaphrosesa we-Chuan IV wonke apakishwe kuleli fomu.
I-2.CBGA (CeramicBCA) substrate: okungukuthi, i-ceramic substrate, ukuxhumana kukagesi phakathi kwe-chip ne-substrate ngokuvamile kuyi-flip-chip
Uyifaka kanjani i-FlipChip (i-FC ngamafuphi).Kusetshenziswa i-Intel series cpus, Pentium l, ll Pentium Pro processors
Uhlobo lwe-encapsulation.
3.I-FCBGA(I-FilpChipBGA) i-substrate: I-substrate enezendlalelo eziningi eqinile.
4.TBGA (TapeBGA) substrate: I-substrate iyiribhoni elithambile 1-2 ungqimba wesekethe ibhodi PCB.
I-5.CDPBGA (i-Carty Down PBGA) i-substrate: ibhekisela endaweni ye-chip yesikwele ephansi (eyaziwa nangokuthi indawo ye-cavity) phakathi nendawo yephakheji.
Iphakethe le-BGA linezici ezilandelayo:
1) .10 Inombolo yezikhonkwane iyanda, kodwa ibanga phakathi kwezikhonkwane likhulu kakhulu kunelo lokupakisha kwe-QFP, okuthuthukisa isivuno.
2) .Nakuba ukusetshenziswa kwamandla kwe-BGA kukhulisiwe, ukusebenza kokushisisa kukagesi kungathuthukiswa ngenxa yendlela yokushisela elawulwayo yokuwa kwe-chip.
3).Ukubambezeleka kokudlulisa isignali kuncane, futhi imvamisa yokuguquguquka ithuthukiswa kakhulu.
4).Umhlangano ungaba yi-coplanar welding, okuthuthukisa kakhulu ukuthembeka.
