Ukuthuthukiswa okudidiyelwe kwe-chip yesekethe edidiyelwe kanye nephakheji ehlanganisiwe ye-elekthronikhi
Ngenxa ye-simulator ye-I/O kanye nokuhlukaniswa kwama-bump kunzima ukunciphisa ngokuthuthukiswa kobuchwepheshe be-IC, ukuzama ukuphusha lo mkhakha ufinyelele ezingeni eliphezulu i-AMD izosebenzisa ubuchwepheshe obuthuthukisiwe be-7Nm, ngo-2020 yethulwa esizukulwaneni sesibili sezakhiwo ezididiyelwe ukuze zibe main computing core, naku-I/O kanye ne-memory interface chips kusetshenziswa isizukulwane sobuchwepheshe esivuthiwe ne-IP, Ukuqinisekisa ukuthi ukuhlanganiswa kwakamuva kwesizukulwane sesibili okusekelwe ekushintshaneni okungapheli nokusebenza okuphezulu, ngenxa ye-chip - ukuxhumana nokuhlanganiswa komklamo ohlanganyelwe, i ukuthuthukiswa kokuphathwa kwesistimu yokupakisha (iwashi, ukunikezwa kwamandla, kanye nongqimba lwe-encapsulation, inkundla yokuhlanganisa engu-2.5 D ifinyelele ngempumelelo imigomo elindelekile, ivula umzila omusha wokuthuthukiswa kwamaphrosesa athuthukile weseva.