I-Semicon Microcontroller Voltage regulator IC Chips TPS62420DRCR SON10 Electronic Components BOM service list

Umqondo wokupakisha:

Umqondo omncane: Inqubo yokuhlela, ukunamathisela, kanye nokuxhuma ama-chips nezinye izici kuhlaka noma i-substrate kusetshenziswa ubuchwepheshe befilimu kanye namasu okwenziwa nge-microfabrication, okuholela kumatheminali kanye nokuwalungisa ngokufaka ibhodwe ngendawo yokuvikela ethambile ukuze kwakheke isakhiwo esinezinhlangothi ezintathu.

Ukukhuluma ngokubanzi: inqubo yokuxhuma kanye nokulungisa iphakheji ku-substrate, ukuyihlanganisa ohlelweni oluphelele noma idivayisi ye-elekthronikhi, nokuqinisekisa ukusebenza okuphelele kwalo lonke uhlelo.

Imisebenzi ezuzwe ngokupakishwa kwe-chip.

1. ukudlulisa imisebenzi;2. ukudlulisa amasignali wesifunda;3. ukuhlinzeka ngendlela yokuqeda ukushisa;4. ukuvikelwa kwesakhiwo nokusekelwa.

Izinga lobuchwepheshe lobunjiniyela bokupakisha.

Ubunjiniyela bokupakisha buqala ngemva kokwenziwa kwe-IC chip futhi buhlanganisa zonke izinqubo ngaphambi kokuba i-IC chip inamathiselwe futhi ilungiswe, ixhumeke, ihlanganiswe, ivalwe futhi ivikelwe, ixhunywe ebhodini lesifunda, futhi uhlelo luhlanganiswe kuze kube yilapho umkhiqizo wokugcina usuqediwe.

Izinga lokuqala: elaziwa nangokuthi i-chip level packaging, inqubo yokulungisa, ukuxhumanisa, nokuvikela i-IC chip ku-substrate yokupakisha noma ifreyimu yokuhola, iyenze ingxenye yemojula (umhlangano) engathathwa kalula futhi ithuthwe futhi ixhunywe. ezingeni elilandelayo lokuhlanganisa.

Izinga lesi-2: Inqubo yokuhlanganisa amaphakheji amaningana ukusuka ezingeni 1 nezinye izingxenye ze-elekthronikhi ukwenza ikhadi lesekhethi.Izinga lesi-3: Inqubo yokuhlanganisa amakhadi esekethe amaningana aqoqwe kusuka kumaphakheji aqedwe ezingeni lesi-2 ukuze akhe ingxenye noma uhlelo oluncane ebhodini elikhulu.

Izinga lesi-4: Inqubo yokuhlanganisa amasistimu angaphansi ambalwa abe umkhiqizo ophelele we-elekthronikhi.

Ku-chip.Inqubo yokuxhuma izingxenye zesekethe ezididiyelwe ku-chip yaziwa nangokuthi ukupakishwa kwezinga elinguziro, ngakho ubunjiniyela bokupakisha bungahlukaniswa ngamaleveli amahlanu.

Ukuhlukaniswa kwamaphakheji:

1, ngokuya ngenani lama-IC chips ephaketheni: iphakethe le-chip eyodwa (SCP) kanye nephakheji ye-multi-chip (MCP).

2, ngokusho umehluko wezinto ezibonakalayo: izinto ze-polymer (ipulasitiki) nezitsha zobumba.

3, ngokuya ngedivayisi kanye nemodi yokuxhumana yebhodi lesifunda: uhlobo lokufakwa kwephini (PTH) kanye nohlobo lwe-surface Mount (SMT) 4, ngokuya ngefomu lokusabalalisa iphini: izikhonkwane ezinohlangothi olulodwa, izikhonkwane ezizinhlangothi ezimbili, izikhonkwane ezinezinhlangothi ezine, kanye izikhonkwane ezingezansi.

Amadivayisi we-SMT anohlobo lwe-L, uhlobo lwe-J, kanye nezikhonkwane zensimbi zohlobo lwe-I.

I-SIP:iphakheji yomugqa owodwa SQP: iphakheji elincane le-MCP: iphakheji yebhodwe lensimbi i-DIP: iphakheji yemigqa ekabili CSP: iphakheji yosayizi we-chip QFP: iphakheji eyisicaba enezinhlangothi ezine PGA: iphakheji ye-matrix yamachashazi BGA: iphakheji yegridi yebhola ye-LCCC: isithwali se-chip ceramic engenamthofu